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Heat sinks can be extruded in high volumes at a relatively low cost. If designing extruded heat sinks, you may wonder which alloy you should choose for your extrusions. Which Aluminum Alloy Should You Use for Your Heat If your first thought is

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Fig. 4. shows the cross-section of an ultra-high extrusion heat sink. Most of these high ratio shapes provide a higher level of cooling capability in a smaller volume of space than their predecessors. Such heat sinks are more efficient in their material usage

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Heatsink Design and Selection Design factors which influence the thermal performance of a heat sink Material The most common heat sink materials are aluminium alloys. Aluminium alloy 1050A has one of the higher thermal conductivity values at 229

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Heat Sink Manufacturing Technologies The most important issue in thermal management of electronics devices is to design cooling systems to maintain the device junction temperature below a set limit called maximum junction temperature. It has been

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Extruded Heat Sinks 47 EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS High-Performance Heat Sinks for 30-100W Metal Power Semiconductors Need maximum heat dissipation from a TO-3 rectifier heat sink in minimum The Wakefield

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Some People Still Think Aluminum Dissipates Heat Better

Some people still think Aluminum dissipates heat better than copper. 96 posts Previous 1 2 3 Next redleader Ars For most heat sinks this is probably the major factor in heat sink

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Extruded Heat Sinks 47 EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS High-Performance Heat Sinks for 30-100W Metal Power Semiconductors Need maximum heat dissipation from a TO-3 rectifier heat sink in minimum The Wakefield

Ultra High Ratio Extrusion Heat Sinks Improve Cooling

Fig. 4. shows the cross-section of an ultra-high extrusion heat sink. Most of these high ratio shapes provide a higher level of cooling capability in a smaller volume of space than their predecessors. Such heat sinks are more efficient in their material usage

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How To Select A Heat Sink Electronics

How to Select a Heat Sink June 1, 1995 Seri Lee Articles , Design , Heat Sinks , Semiconductor , Test Measurement Heat Sink , IC , Microelectronics , Semiconductor , Thermal Resistance With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product

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The heat dissipated via radiation is strongly dependent on temperature of the heat sink sink since raised to the forth power as seen in equations 1 and 2. To provide a comparison of the influence of radiation on the performance of a plate fin heat sink two examples were analyzed using the HeatSinkCalculator

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